Xilence X5 thermal paste was specifically designed for high-end processors. The very high thermal conductivity ensures for an efficient heat exchange and low temperatures! The paste works reliably at temperatures from -50 to +300°C therefore, it is particularly well suited for extreme overclocking. Since the X5 is not electrically conductive, there is no danger for the surrounding hardware! Contents: 2.5 g.
Viscosity: 76 CPS
Heat conductance: 1.45 W/(K·m)
Thermal resistance: 0.023°C cm2/W
Dielectric constant A: > 6
Operation temperature: -50 ~ +300°C
Dimension: 10 x 110 x 25mm